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DotBond® and FullBond® Glue bonding technology

In-die DotBond® and FullBond® Glue bonding technology for high efficiency electric powertrain applications.


Lamination stacks bonded together with glue inside die, for high efficiency electric powertrain applications. This technology is currently in patent filing phase, offering a complete surface of glue for an improved rigidity and optimized alignment, perpendicularity and parallelism.